1. 2. 3. material content data sheet sales product name igw30n100t issued 29. august 2013 ma# MA000518308 package pg-to247-3-41 weight* 6048.28 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 5.891 0.10 0.10 974 974 leadframe non noble metal iron 7439-89-6 0.530 0.01 88 inorganic material phosphorus 7723-14-0 0.159 0.00 26 non noble metal copper 7440-50-8 529.068 8.75 8.76 87474 87588 wire non noble metal aluminium 7429-90-5 7.860 0.13 0.13 1300 1300 encapsulation organic material carbon black 1333-86-4 19.978 0.33 3303 plastics epoxy resin - 379.573 6.28 62757 inorganic material silicondioxide 60676-86-0 1598.201 26.42 33.03 264240 330300 leadfinish non noble metal tin 7440-31-5 31.874 0.53 0.53 5270 5270 plating non noble metal nickel 7440-02-0 29.065 0.48 0.48 4805 4805 solder non noble metal antimony 7440-36-0 0.360 0.01 60 noble metal silver 7440-22-4 0.900 0.01 149 non noble metal tin 7440-31-5 2.341 0.04 0.06 387 596 heatspreader inorganic material phosphorus 7723-14-0 1.033 0.02 171 non noble metal iron 7439-89-6 3.442 0.06 569 non noble metal copper 7440-50-8 3438.006 56.83 56.91 568427 569167 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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